An equipment named A3DOI-BGA (Ball Grid Array Package) was newly developed by scientists from the Hefei Institutes of Physical Science (HFIPS) of the Chinese Academy of Sciences to help check visual problems of Graphics Processing Unit-Lingjiu GP102.

After a series of testing procedures, the first BGA chip appearance inspection device is ready for market. 

"We have a self-developed software platform," said HUANG Xuan, who led the team, "through which we achieve the perfect integration of three-dimensional (3D) visual measurement technology and visual defection detection technology." 

It took the team half a year to complete the design and testing. In order to meet the requirements of chip ex-factory quality control and chip traceability, the team collected chip 3D image data, plane RGB image data, laser point cloud data, etc., and combined them with traditional and artificial intelligence algorithms. 

Finally, the measurement accuracy, defect recognition rate and other performance indicators have reached the required standards, with some indicators exceeding current testing equipment on market.

High compatibility is another feature of the testing equipment. The core sensors have ultra-high measurement accuracy at micron level, which can be applied to various BGA chips for 3D contour measurement. 

This 3D vision measurement technology provided professional, high-precision, and reliable visual technical services for chip manufacturing users.

Ball Grid Array Package (BGA) chip appearance inspection equipment helped to check the visual problem of Graphics Processing Unit -- Lingjiu GP102. (Image by HUANG Xuan)